Todays’ electronic systems must meet ultra-low-power requirements while delivering GHz+ performance, and produce all this for the lowest possible cost. Meeting these conflicting demands requires a holistic approach that combines chip, package, and system designs. ANSYS and Apache’s Chip-Package-System (CPS) methodology with modeling technology for every step of the design process allows cross-domain information sharing to avoid over-design and accurately predict the performance of the combined system.

  • CPS Methodology

    Apache's CPS solution offers integrated analysis and verification methodology that helps meet the challenges in the design of chips, packages and boards.

  • CPS Education

    Learn more about CPS methodology from industry leaders through technical papers, presentations, and webcasts.

  • CPS News & Information

    Read Apache's latest technical articles and view informative videos on CPS.

  • CPS User Group

    The Chip-Package-System User Group enables collaboration across multiple design disciplines.

  • CPS Blogs

    Catch up on blogs covering CPS related topics.