- PowerArtistRTL Power Reduction, Analysis, Debug, and RPM Generation
- RedHawkSoC Dynamic Power, Advanced Low Power, Reliability, and Chip-Package Co-design
- TotemAnalog/Mixed-Signal Dynamic Power, Substrate Noise, EM, and ESD
- SentinelChip-Package-System Power/Signal Integrity, IO-SSO, Thermal, and EMI
- ResourcesTechnical Papers and Presentations, Contributed Articles and Conference Papers, Webinars and Videos
ANSYS and Subsidiary Apache Receive TSMC 20nm Phase I Certification
PITTSBUGH – June 4, 2012 – ANSYS (NASDAQ: ANSS) and subsidiary Apache Design announced today that their RedHawk™ and Totem™ products achieved TSMC Phase I 20 nm certification. TSMC certified the tools for 20 nm design rule manuals (DRMs) and SPICE models. Early adopters are using the flows and tools while close collaboration continues between TSMC, ANSYS, Apache and designers.
RedHawk and Totem provide power, noise and reliability signoff for system-on-chip and mixed-signal designs at advanced technology nodes. RedHawk also addresses electromigration by delivering current direction-aware, metal topology-aware and temperature-aware checks as well as expanded capabilities to support TSMC’s 20 nm electromigration rules. Totem provides full-chip, layout-based power and noise analysis for analog and mixed-signal designs.
In addition, ANSYS technologies interface with TSMC’s 3D-IC flow to deliver accurate thermal profiles through iterative analysis of power maps and boundary conditions.
“Apache delivers innovative solutions that address power, noise and reliability challenges for the most advanced process nodes and emerging design technologies,” said Andrew Yang, president of Apache, a subsidiary of ANSYS. “Our collaboration with TSMC enables us to provide optimized tools and methodologies for advanced-technology designers.”
“With ANSYS and Apache 20 nm certification at TSMC, companies will be able to produce more robust designs and deliver next-generation products to the marketplace,” said Suk Lee, TSMC senior director, design infrastructure marketing division.
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June 4th, 2012