- PowerArtistRTL Power Reduction, Analysis, Debug, and RPM Generation
- RedHawkSoC Dynamic Power, Advanced Low Power, Reliability, and Chip-Package Co-design
- TotemAnalog/Mixed-Signal Dynamic Power, Substrate Noise, EM, and ESD
- SentinelChip-Package-System Power/Signal Integrity, IO-SSO, Thermal, and EMI
- ResourcesTechnical Papers and Presentations, Contributed Articles and Conference Papers, Webinars and Videos
Advisory: Apache Demonstrates IC Power Analysis, Optimization and Sign-off Solutions at Design Automation Conference
ANSYS Subsidiary’s Customers Present Methodologies for Advanced Low-power, Power Delivery Integrity, Reliability, Chip-Package-System and 3D-IC Design Challenges
PITTSBURGH – May 30, 2012 – ANSYS (NASDAQ: ANSS) subsidiary Apache Design, Inc. will exhibit its industry-leading simulation software platforms and methodologies that meet integrated circuit (IC) power, performance and price demands for low-power mobile, high-performance computing, consumer and automotive electronics at the Design Automation Conference (DAC).
Where: Design Automation Conference, Moscone Convention Center, San Francisco, CA, Booth #1813
When: Monday, June 3 through Wednesday, June 6, from 9:00 a.m. to 6:00 p.m.
What: Meet with Apache, its customers, and partners at DAC to hear leading companies share their expert perspectives and best practices. Live presentations will feature low-power design methodologies with LSI and Renesas; power delivery integrity with Aptina, Ciena, NXP Semiconductor, Samsung-DT and Samsung-SSI; advanced reliability simulation with AMD and nVidia; chip-package-system analysis with Samsung-DRAM and ST-Ericsson; and 3D-IC / stacked-die design challenges with UCSD. Click here to register for a session.
Apache’s Power Team Experts will be on hand to discuss and demonstrate the latest advanced methodologies and design techniques for ultra-low-power, reliability, chip-package-system, and 3D-IC solutions, including the recently announced RedHawk-3DX fourth-generation power sign-off solution. Click here to register now.
Working with Apache’s eco-system partners is key to advancing low-power innovation in today’s fast-paced industry environment. Apache will be participating and speaking in several partner booths at DAC including:
ARM Connected Community Pavilion – Booth #802
Tuesday, June 5 at 11:00 a.m.
GlobalFoundries Partner Pavilion – Booth #303
Wednesday, June 6 at 1:00pm
TSMC OIP Theater – Booth #2430
Monday, June 4 at 10:00 a.m.
Tuesday, June 5 at 3:30 p.m.
Wednesday, June 6 at 1:45 p.m.
Apache technology experts will also be participating in several DAC panel sessions discussing a variety of industry topics including:
DAC Panel Pavilion – Booth #310
Monday, June 4 at 10:30 a.m.
Si2 Round-Up: Standards in Action – Room #301
Monday, June 4 at 3:15 p.m.
Click here for a complete schedule.
Details of Apache’s DAC activities, along with advanced registration for customer and product presentations can be found at http://www.apache-da.com/company/events/DAC2012. Register and attend three or more Apache customer presentations and enter a drawing to win an Apple® MacBook Air.
ANSYS and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.
May 30th, 2012