Apache’s Power Closure Sign-Off Flow Enables First-Pass Silicon Success for Airgo Networks

Mountain View, Calif. – April 4, 2005 – Apache Design Solutions, the technology leader in physical power integrity solutions for system-on-chip (SoC) designs, today announced that Airgo Networks, pioneer and world leader of multiple input/multiple output (MIMO) technology used Apache’s RedHawk full-chip dynamic power integrity solution to achieve first-pass silicon success of their 802.11 next generation Wi-Fi chipset. Airgo successfully taped out multiple designs using Apache’s physical power integrity solution.

“RedHawk enabled us to analyze dynamic voltage drop effects in addition to static IR drop analysis, resulting in more robust designs,” said Derrick Lin, senior director of engineering at Airgo. “RedHawk’s ability to accurately detect potential chip failures caused by dynamic power supply noise prior to tape out has provided us with a high degree of confidence in our power grid design. RedHawk is an integral part of our sign-off flow.”

“With over 30 customers and 100 tapeouts worldwide, our physical power integrity solution is making a significant contribution in lowering production cost and increasing manufacturing yield,” stated Andrew Yang, CEO of Apache. “The adoption of our power closure flow by a leading Wi-Fi technology company such as Airgo further reinforces how our solution is addressing the critical missing link in advanced nanometer designs.”

Apache Design Solutions, NSPICE, RedHawk, PsiWinder, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc.