Apache Releases Chip-Package-System Reference Flow V1.0

March 17, 2011

As a collaborative effort between the IC design community and Apache Design Solutions, the Chip-Package-System (CPS) Reference Flow Version 1.0 document has been released.  The goal of this document is to provide clarity in the creation and usage of Chip Power Models (CPM™) for CPS co-design in a multitude of applications such as power delivery network design optimization and EMI/EMC modeling. Standard procedures for a variety of applications are laid out for the generation, validation, and usage of CPM for system-level simulation.  The efforts put into the creation of this document provide benefit to users by enabling faster delivery of electronic systems designed and manufactured at lower costs.

CPM technology has been used extensively to create models of an integrated circuit or chip to enable CPS co-design since its introduction in 2006. It leverages the full-chip time-domain and AC analysis technologies available in RedHawk™ to create a compact, yet highly accurate electrical representation of the chip in various operating modes. CPM has enabled package and board level engineers to perform their package and board level AC, DC, time-domain and EMI/EMC simulations by factoring in the presence of the die (or die(s) as the case may be).
Apache Design Solutions would like to extend their appreciation to the members of the Chip-Package-System (CPS) User Group.  The guidance and participation of the members  of this group has enabled the creation of the CPS Reference Flow as an synergistic intersection between designer usage needs and Apache modeling expertise. 

This document has been made available to all Apache customers on the RedHawk and Sentinel Support site under Application Notes: Chip-Package-System (CPS) Reference Flow Document – v1.2.