System Power Noise Reliability

Sentinel is a Power-Noise-Reliability platform for IC-aware IC Package, SiP, and PCB co-analysis and co-optimization. It addresses system-level power, signal, and thermal integrity challenges by delivering the industry’s first fully integrated co-analysis and System-in-Package (SiP) solutions.

Sentinel System PNR solution includes the following products and capabilities.

PakSi-E
Versatile 3D quasi-static electromagnetic simulation tool for extraction and modeling of electronic packaging designs.

Chip Power Model (CPM)
Compact SPICE-compatible model of the IC’s power delivery network, enabling package/board designers to analyze and optimize their design with greater accuracy and eliminating the need for over-design.

Sentinel-PI
3D full-wave package and board extraction and co-analysis solution with the ability to perform DC (static), AC (frequency domain), and transient (dynamic) power integrity analysis. Native integration of CPM enables IC-aware package/board power integrity.

Sentinel-TI
IC-aware package and board thermal integrity solution with accuracy and ease-of-use for analyzing the effects of thermal and mechanical stresses on a variety of custom and industry-standard package styles.

Sentinel-SSO
High-capacity global I/O-SSO solution with the capacity to simulate an entire bank of I/Os under simultaneous switching condition and SPICE-level accuracy.

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