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The Newsletter from Apache Design Solutions is your source for latest news, industry happenings, product updates, and technical papers.

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June 2009

In this issue … Learn about Totem, the industry’s first power and noise integrity platform for analog and mixed-signal designs; visit the new Peer-to-Peer, Geek-to-Geek "Technology Focused" Blog - Techguri and hear the latest interviews with Apache executives.

January 2009

In this issue … Learn about RedHawk-NX, the next generation dynamic power integrity solution re-architected to handle designs of five hundred million gates, while maintaining sign-off accuracy; read the latest article on Chip/Package/PCB co-simulation – what it is, why it’s needed - SCDsource; and see what Apache is doing duriing DesignCon 2009..

September 2008

In this issue … Learn about Sentinel-PI, a next generation IC-aware, 3D full-wave power integrity solution for package, SiP and PCB designs; Read the EMC Symposium Conference paper, Development and Validation of a Microcontroller Model for EMC; and viewpoints and interviews on chip-package-system co-design.

May 2008

Special DAC Edition

February 2008

In this issue … Learn about Sentinel-CPM, EDN’s 2007 Innovation of the Year Award Winner; Read a featured article on the Optimal acquisition and how the merging of technologies from Apache and Optimal will deliver true IC-Package-System co-analysis solutions from prototyping to signoff.

April 2007

In this issue …Read technical articles on Silicon Integrity Platform, Clock Jitter Analysis, and Thermal Integrity of Chip/Package Systems.

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