In the News

SCD Source - 07/08/2008
Apache extends power integrity to packages and PCBs

EETimes - 06/30/2008
Are IC thermal problems hot air?

Electronic Design - 06/12/2008
Editorial Video from DAC 2008 with Dave DeMaria

EDACafe - 06/12/2008
Video Interview at DAC 2008 with Dave DeMaria

EDACafe - 06/12/2008
First "Best of DAC" Winners Announced in Anaheim

EDN - 06/08/2008
TSMC's new reference flow reflects concerns of designers at 40 nm

Chip Design - 06/04/2008
Time to Make Noise about Co-design - Got Package?

Electronic Design - 05/22/2008
45th DAC Takes The SoC Methodology Plunge

Chip Design - 05/21/2008
Max's Chips and Dips: Apache's New Chip-Package Solution

SCD Source - 05/20/2008
Apache analyzes power across chips, packages and boards

DACeZine - 02/07/2008
Interview with Andrew Yang, Apache CEO

EDN - 02/01/2008
Sentinel-CPM selected as EDN Innovation Award Finalist

SCD Source - 01/02/2008
Ten 2008 trends in system and chip design