In the News

EDACafe - 02/26/2010
Practical Design Integrity Solutions - DesignCon Interview

PCB007 - 02/08/2010
Bringing Together Chips, Packages and PCBs

EETimes - 01/25/2010
Apache posts double-digit growth in 2009

DigiTimes - 11/12/2009
Apache Taiwan Technology Forum 2009 Article

Low-Power Engineering Community - 10/15/2009
Considerations For Choosing The Right Low-Power Tools

Gary Smith EDA - 09/17/2009
Acquisition Viewpoint

EDA Confidential - 09/09/2009
Apache + Sequence = Power to the People

EDN - 09/08/2009
EDA Carnivores, part 2: Apache acquires Sequence Design

EDACafe - 07/28/2009
"New Totem and RedHawk Products" Interview with Dian Yang

Gary Smith EDA - 06/12/2009
EDA Vendors: Chip-Package-System Co-Design

Demos on Demand - 04/30/2009
Richard Goering interviews Andrew Yang

EDN - 04/21/2009
Totem offers full-chip power- and noise-integrity analysis for chips with analog content

EDN - 04/21/2009
TSMC sign-off flows and reference designs: helping customers and treading on toes?

EETimes - 04/21/2009
TSMC rolls sign-off flow, RF design kit

PCBDesign007 - 02/04/2009
Apache CEO, Andrew Yang Interview with PCBDesign007 at DesignCon

EDA Cafe - 02/04/2009
Apache Aveek Sarkar Interview with EDA Cafe at DesignCon

EDA Design Line - 01/08/2009
Apache Design Solutions introduces RedHawk-NX

EETimes - 01/07/2009
Apache rolls next-gen dynamic power integrity tool

EDN - 01/07/2009
Apache forges ahead with RedHawk-NX power analysis

SCDsource - 01/07/2009
Apache upgrades RedHawk for full-chip power integrity

EDACafe - 01/07/2009
The New RedHawk NX Power Integrity Analysis